CyrusOne Deploys Liquid to Chip Cooling Solution with Asetek
Global data center company CyrusOne (NASDAQ: CONE) has announced the use of the latest Internet Computer Concepts (ICC) and Asetek technologies for cooling design solutions across its data center campuses. The technology, coupled with CyrusOne’s standard cooling design, would foster simple deployment and low power usage effectiveness (PUE). It’s the latest effort for the company’s goal to achieve the highest level of sustainability.
“We’re approaching a new era of computing, AI, and cloud services. We’re excited about the opportunity to leverage ICC’s solution, along with Asetek’s liquid cooling technology,” said Kevin Timmons, Chief Technology Officer (CTO) at CyrusOne.
Traditionally, data centers are air-cooled and do not have access to chilled water capabilities. Liquid would be “4,000 times” better than air though at storing and transferring this heat emission. CyrusOne preplans for these technologies in all of their data center builds. These plans include installing taps for both chilled and warm water deployments, which can be used for in-row cooling, liquid to cabinet, liquid to chip, and immersion cooling.
“We’re approaching a new era of computing, AI, and cloud services. We want to ensure our customers have access to a flexible, cost-saving environment to meet their high-performance requirements,” said Kevin Timmons, Chief Technology Officer (CTO) at CyrusOne. “We’re excited about the opportunity to leverage ICC’s solution, along with Asetek’s liquid cooling technology to offer the latest features that meet clients’ evolving needs and support new technology that improves our customers’ workload efficiency and drives improved PUE, part of our commitment to improved sustainability.”
High-Performance AMD Processors
CyrusOne operates nearly 50 data centers worldwide. Its carrier-neutral data center properties are built to ensure the continued operation of IT infrastructures for approximately 1,000 customers, including more than 200 Fortune 1000 companies.
“ICC’s new custom liquid cooling solution enables high-performance AMD processors in clusters with high interconnect densities, while reducing overall data center cooling costs,” said Alexey Stolyar, Director of Development at ICC. “The energy savings and enhanced performance are uniquely suited for HPC environments.”